The outline of bump bond process steps. (1) deposition of field metal
By A Mystery Man Writer
Description
The outline of bump bond process steps. (1) deposition of field metal
Left) X-ray image of a line pair rule taken using an un-collimated
Hans ANDERSSON, Principal Research Engineer
Outline functional block diagram of the ESA ROIC front end-one pixel
Left) A 64 x 64 pixel GaAs array produced to qualify the bump bonding
A. Peacock's research works European Space Agency, Paris (ESA) and other places
Left) A 64 x 64 pixel GaAs array produced to qualify the bump bonding
A. Peacock's research works European Space Agency, Paris (ESA) and other places
Hans ANDERSSON, Principal Research Engineer
Left) X-ray image of a line pair rule taken using an un-collimated
Hans ANDERSSON, Principal Research Engineer
Left) X-ray image of a line pair rule taken using an un-collimated
Left) X-ray image of a line pair rule taken using an un-collimated
A. Peacock's research works European Space Agency, Paris (ESA) and other places
Hans ANDERSSON, Principal Research Engineer
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