SEM of insulated wire bonds (study A). Dark stripes on deformed
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Phase transformation and deformation behavior of NiTi-Nb eutectic
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PDF) Wire Bonding UPH and Stitch Bond Improvement using 20 Micron Diameter Insulated Wire with Security Bump
a) Microstructure of a 5PtNiAl bond coat cross-section showing all
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Defective crescent bonds. (a) Lift off. (b) Excessive wire
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